Principal Engineer Cross Platform Technology Integration
Core
Lead technology integration across multiple platforms for new chip technology, harmonizing unit processes and mitigating interaction risks.
Role type
Principal Engineer, Cross-Platform Technology Integration
Builds
New chip technology and cross-platform integration solutions
Domain
Semiconductor manufacturing and packaging
Required skills
Semiconductor packaging, assembly, and testing expertise, 8D problem-solving, DFMEA/PFMEA, DOE, reliability analysis, risk interaction assessment, cross-platform collaboration
Preferred skills
None stated
Technologies
None stated
Responsibilities
Act as TI lead for new technology involving multiple platforms, own Risk Interaction assessment and mitigation, drive integration of unit processes (BOM and Process) for new chip technology, work as a partner for FE/BE interaction topics, drive synergy and best practice implementation across platforms, provide technical guidance on interaction topics
Seniority
Principal, hands-on IC
