CareerPlan

Process Engineer

Hal Kirkop, MaltaFull-time2026-10-26 → 2026-11-10
Hybrid

Core

Optimizing process parameters and materials to improve yield, quality, and robustness in wire bonding and SMT manufacturing.

Role type

Manufacturing Process Engineer (Wire Bonding & SMT)

Builds

Wire bonding and SMT production lines

Domain

Semiconductor manufacturing

Required skills

Process optimization, data analysis, materials science, SMT processes, project management, 5S principles, equipment interfacing

Preferred skills

Problem-solving, technical community participation, audit support

Technologies

Wire bonding equipment, SMT equipment, data collection systems

Responsibilities

Optimize process parameters and materials; conduct wire bonding trials; verify new recipes and processes; enhance equipment functionality; manage new equipment acquisition projects; monitor process quality and machine productivity; liaise with production and equipment manufacturers; support audits and data analysis programs.

Seniority

Mid-level, hands-on IC