CDI - Responsable de Projet Technique de Conception & Développement de Boitiers Microelectronique H/F
Core
Lead the design, feasibility, and development of advanced microelectronic packages and substrates for optical sensors, silicon photonics, and related applications.
Role type
Senior IC Technical Package Leader (Microelectronics Packaging)
Builds
Microelectronic packages and substrates for optical sensors, silicon photonics, and datacenter applications
Domain
Semiconductor manufacturing / Microelectronics packaging
Required skills
Package architecture definition, material selection, assembly technology selection, OSAT and supplier management, process improvement, project coordination, mass production ramp-up
Preferred skills
Experience with optical sensors and silicon photonics, knowledge of industrial assembly processes
Technologies
Optical sensors, Silicon Photonics, Printed Circuit Boards (PCB), OSATs
Responsibilities
Define package and substrate architecture and materials, select appropriate assembly technology, coordinate technical core team, analyze technical data and constraints, drive continuous improvement of manufacturing rules, manage project maturity to mass production
Seniority
Senior, hands-on IC