BE Operation Engineer
Core
Lead the industrialization of ST's advanced back-end technology bricks for Analog products, specifically WLCSP, transforming engineering concepts into scalable mass production with external partners.
Role type
Senior IC back-end technology engineer (packaging)
Builds
Scalable mass production processes for WLCSP and back-end technology bricks
Domain
Semiconductor manufacturing (back-end/packaging)
Required skills
WLCSP technology, back-end manufacturing processes, OSAT partner management, data analysis, yield improvement, technical negotiation
Preferred skills
Semiconductor front-end experience, STEM Master's degree
Technologies
WLCSP, OSAT tools
Responsibilities
Lead transfer and industrialization of WLCSP technology with third-party partners/OSATs; Serve as primary technical interface to align external partners with quality and yield standards; Evaluate production data to identify bottlenecks and drive continuous yield improvement
Seniority
Mid-level, hands-on IC