Process Engineer – Leadframe Process & Tooling Expert
Core
Development, optimization, and sustaining of assembly leadframe processes, with primary ownership of Lead Lock Tape and Lead Trimming operations.
Role type
Leadframe Process Engineer
Builds
Semiconductor assembly leadframes
Domain
Semiconductor manufacturing (back-end assembly)
Required skills
Lead Lock Tape process expertise, Lead Trimming process expertise, tooling design and qualification, root cause analysis, DOE, SPC, FMEA, 8D, 5 Why, Fishbone Analysis, data analysis (Excel, Minitab), process documentation, vendor coordination, operator training
Preferred skills
Semiconductor back-end assembly experience, leadframe stamping/plating/trimming/forming knowledge, Lean Manufacturing, Six Sigma, customer issue resolution, reliability investigations
Technologies
Excel, Minitab
Responsibilities
Define, optimize, and troubleshoot process parameters for stable output and high yield; support tooling design, qualification, modification, and troubleshooting; investigate process and tooling issues and implement corrective actions; lead process improvement activities; support NPI, process transfer, qualification, and ramp-up; conduct process capability analysis, DOE, SPC, and yield loss studies; drive scrap reduction and productivity enhancement; maintain process documentation (SOPs, control plans); train and coach operators and technicians
Seniority
Mid-Senior, hands-on IC
