Research Analyst - Memory Technology
Core
Analyze and forecast DRAM, NAND, and HBM process technologies, manufacturing roadmaps, and packaging innovations to translate complex technical developments into differentiated research for institutional clients.
Role type
Senior IC semiconductor process technology analyst
Builds
Industry models on memory shipments, datacenter demand, and supply chain dynamics
Domain
Semiconductor manufacturing (Memory: DRAM, NAND, HBM) and Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research
Required skills
DRAM process flows, NAND process flows, front-end-of-line manufacturing, back-end-of-line manufacturing, capacitor scaling, high-k/metal-gate integration, high-aspect-ratio etch, channel-hole scaling, TSV formation, wafer thinning, stacking, bonding, interconnect technologies, advanced packaging economics, competitive benchmarking, yield analysis, cost-per-bit analysis, technical disclosure interpretation, patent analysis, teardown data analysis
Preferred skills
Korean language proficiency, professional relationships in Korean memory fabs, hands-on fab experience, failure analysis techniques, SEM/TEM interpretation, cost modeling, equipment familiarity
Technologies
EUV, 4F² cells, vertical-channel transistors, 3D DRAM, hybrid bonding, microbumps, known-good-die
Responsibilities
Analyze and forecast DRAM process-technology roadmaps across major memory manufacturers. Evaluate capacitor-scaling limits, high-k/metal-gate integration, and other key process-integration challenges. Track EUV insertion by process layer, technology node, and vendor. Assess transitions toward 4F² cells, vertical-channel transistor architectures, and longer-term 3D DRAM approaches. Analyze and forecast NAND layer-count and string-stacking roadmaps. Assess HBM manufacturing and packaging technologies in depth. Benchmark process-technology competitiveness across Samsung, SK hynix, Micron, Kioxia, SanDisk, CXMT, and YMTC. Map memory-technology transitions to demand for wafer-fabrication equipment, materials, and process-control tools. Track memory-relevant developments presented at IEDM, ISSCC, VLSI, ECTC, and major vendor technology events.
Seniority
Senior, hands-on IC