Manufacturing Operations Technical Programme Manager – Silicon and Packaging
Core
Manage end-to-end silicon production, packaging design, and delivery flow from wafer through to contract manufacturer.
Role type
Manufacturing Operations Technical Programme Manager
Builds
Packaged silicon for advanced AI models
Domain
Semiconductor manufacturing and packaging
Deliverable
production ML models
Required skills
Technical project management, supply chain management, semiconductor production knowledge, foundry/OSAT coordination, risk management, schedule management, stakeholder management, NPI management, production ramp management
Preferred skills
Advanced packaging knowledge, high-performance compute experience, chiplets expertise, 2.5D/3D integration knowledge, HBM package experience, silicon bring-up experience, yield tracking experience, Asian supply chain experience
Technologies
Jira, Confluence, Linear, Asana, Smartsheet, MS Project, PLM systems
Responsibilities
Own end-to-end project plan from wafer production to packaged silicon delivery, coordinate day-to-day activity with foundry and OSAT partners, track milestones across wafer starts to shipment, manage risks and dependencies, ensure manufacturing documentation and build readiness materials are complete, support NPI and production ramp, lead manufacturing operations programme reviews, contribute to scalable programme management practices
Seniority
Mid-Senior, hands-on IC
