Senior Engineer, Field Process (Boise, ID)
Core
Lead on-site process development, qualification, and transfer of new ASM deposition systems and products for semiconductor customers.
Role type
Senior Field Process Engineer (NPI & HVM)
Builds
New semiconductor deposition systems and processes for DRAM, NAND, and advanced packaging applications
Domain
Semiconductor manufacturing / Thin-film deposition
Required skills
Thin-film processing, deposition reactor operation, root cause analysis, Design of Experiments (DOE), statistical analysis, process transfer, equipment troubleshooting
Preferred skills
DRAM/NAND device integration, advanced packaging (wafer-level hybrid bonding, fusion bonding), ALD/PECVD/Epitaxy tool expertise, Best Known Methods (BKMs) development
Technologies
PEALD, PECVD, Epitaxy, LPCVD, thermal ALD, vacuum techniques, film characterization, metrology
Responsibilities
Lead joint process development and qualification of new ASM systems at customer sites; Manage introduction and transfer of new processes and hardware to customer sites; Perform problem assessment and root cause analysis of system performance non-conformances; Lead process transfer to High-Volume Manufacturing (HVM) fabs; Document process learnings and develop Best Known Methods (BKMs); Facilitate knowledge transfer to local process and service teams
Seniority
Senior, hands-on IC
