Technical Lead Package Platform Engineer
Core
Lead the development, qualification, and high-volume manufacturing of advanced FCBGA semiconductor packages from concept to production.
Role type
Senior IC Technical Lead Package Platform Engineer
Builds
Advanced FCBGA packages, laminate substrates, and related connectivity solutions for AI infrastructure
Domain
Semiconductor manufacturing / Electronic packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> product features (physical packages)
Required skills
FCBGA assembly manufacturing, laminate substrate technologies, NPI development, supplier management (substrate/OSAT), technical project management, root cause analysis, failure analysis, warpage characterization, cross-functional collaboration
Preferred skills
Cadence Allegro Package Designer (APD), system-level reliability assessment, Co-Packaged Optics (CPO), Near-Packaged Optics (NPO)
Technologies
FCBGA, CXL, Ethernet, NVLink, PCIe, UALink, COSMOS software, Cadence Allegro
Responsibilities
Lead FCBGA package NPI from die netlist to production release; Manage technical execution with substrate suppliers and OSAT partners; Lead package reliability assessment and qualification planning; Investigate and resolve customer returns and field quality issues; Drive root cause analysis and corrective actions; Support package and substrate warpage characterization and improvement.
Seniority
Senior, hands-on IC with technical leadership