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Principal Product Application Engineer

Taipei💼 Full-time🗓 2026-08-10 → 2026-09-25

Core

Provide technical guidance to ODMs on semiconductor design challenges, generate product collateral, and drive innovation through feedback to internal teams.

Role type

Principal Product Application Engineer (High-Speed Interconnects)

Builds

Custom connectivity solutions and standards-based portfolio for hyperscalers and ecosystem partners

Domain

Semiconductor hardware, high-speed interconnects (PCIe/CXL), Data Center infrastructure

Deliverable

product features

Required skills

PCIe LTSSM physical layer expertise, silicon/system bring-up and debug, protocol analyzer usage, technical writing, customer issue resolution leadership

Preferred skills

PCIe 5.0/CXL experience, switch/retimer product support, compliance testing, firmware scripting (Python/C), Data Center system architecture knowledge

Technologies

PCIe, CXL, Ethernet, NVLink, UALink, C-language, Python

Responsibilities

Overcome ODM design challenges, generate application notes and guides, lead internal teams for issue resolution, perform lab debugging with high-speed equipment, support global customer on-site activities

Seniority

Principal, hands-on IC with strategic customer engagement

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