Director Engineering Operations
Core
Lead product and test engineering for high-speed semiconductor connectivity solutions (PCIe, Ethernet, NVLink) through OSAT partners, ensuring qualification, yield, and high-volume manufacturing flow.
Role type
Senior IC Product and Test Engineering Director
Builds
High-speed connectivity chips (XCVR) and semiconductor packages for AI infrastructure
Domain
Semiconductor / High-speed interconnects / Test Engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
High-speed product and test engineering (8-10+ years), PCIe Gen4+ qualification, ATE program development, statistical analysis for limit setting, team management, circuit level analysis (digital/analog), yield analysis, JMP/Spotfire data analysis
Preferred skills
Silicon validation, firmware development (C/C++), Python scripting, product/package qualification
Technologies
Advantest 93k ATE platform, PCIe Gen4+, Ethernet 25G+, (LP)DDR5/4, CXL, NVLink, UALink, C/C++, Python
Responsibilities
Manage and build a product and test team complementing US-based engineers, run standards-based qualification for new and HVM products, develop and revise ATE test programs for wafer sort and final test, monitor device yields and test times, ensure smooth manufacturing flow with OSAT partners, analyze product yields to ensure on-time customer shipments
Seniority
Director, hands-on IC leadership
