MTS, NAND PI
Core
Design, develop, integrate, and implement process solutions to improve next-generation 3D NAND product yield and quality with competitive cost and performance.
Role type
Senior IC process integration engineer (NAND)
Builds
3D NAND semiconductor integrated circuits
Domain
Semiconductor manufacturing / Memory storage
Deliverable
production ML models
Required skills
Process integration, Yield management, Reliability analysis, Material innovation, Experimental design, Team leadership, Strategic planning, Data analysis, Problem-solving, Technology transfer
Preferred skills
AI tool integration, Scripting/programming, SolidWorks, Tableau, Power BI, Non-volatile memory knowledge
Technologies
Python, SolidWorks, Tableau, Power BI
Responsibilities
Lead process modules for 3D NAND development, define structural specifications and process requirements, set strategic direction and improvement plans, resolve structure/electrical/reliability issues proactively, optimize performance and manufacturability, analyze materials for development, design and implement device/process experiments, lead development teams, make key decisions and set goals, innovate to address complex problems and generate IP, coordinate multi-functional activities, support technology transfer to manufacturing.
Seniority
Senior, hands-on IC with leadership responsibilities