New College Grad - HBM PYE Product Development Failure Analysis Enginee
Core
Identify, analyze, and resolve product and process-related issues impacting yield, reliability, and performance of next-generation High Bandwidth Memory (HBM) products using electrical characterization, physical analysis, and AI-enabled data tools.
Role type
New College Grad - Product Development Failure Analysis Engineer (HBM)
Builds
Next-generation High Bandwidth Memory (HBM) products for the semiconductor industry
Domain
Semiconductor manufacturing and memory technology
Deliverable
production ML models
Required skills
Semiconductor device physics, semiconductor manufacturing processes, VLSI design, statistical analysis techniques, Python programming, electrical characterization, physical analysis techniques, data-driven problem solving
Preferred skills
Master's degree in EE/Physics/Materials Science, semiconductor failure analysis experience, yield enhancement experience, reliability engineering experience, AI/Generative AI application experience, knowledge of HBM products, statistical software/machine learning techniques
Technologies
Python, AI-enabled data analysis tools, statistical software
Responsibilities
Perform electrical, physical, and statistical failure analysis to identify component failure mechanisms; Analyze characterization and manufacturing data to determine root causes of failures; Collaborate with cross-functional teams to resolve yield and reliability issues; Leverage AI tools to evaluate large datasets and improve component performance; Communicate findings and risk assessments to support product qualification and production ramp
