CareerPlan

DRAM Pathfinding & Process Integration Engineer

Albany, New York, United States of AmericaFull-time$159k–$271k2026-10-30 → 2026-11-10
Based in United States

Core

Lead early-phase technology investigation and process integration for next-generation DRAM architectures, defining requirements and translating them into coordinated process solutions.

Role type

Senior IC process integration engineer (semiconductor R&D)

Builds

Next-generation DRAM technologies and process flows

Domain

Semiconductor manufacturing / Memory technology

Deliverable

production ML models

Required skills

Semiconductor process integration, DRAM architecture knowledge, DOE methodologies, statistical analysis, High-NA EUV lithography, cross-functional technical leadership

Preferred skills

Ph.D. in EE/Physics/Materials Science, EUV experience, technology scouting, Python/JMP/SQL/machine learning proficiency

Technologies

High-NA EUV, DOE, JMP, SQL, Python, machine learning

Responsibilities

Lead investigation of upcoming DRAM technology concepts and materials; Develop and integrate novel process flows for next-gen DRAM; Evaluate process interactions affecting pattern fidelity and yield; Build and complete DOE plans and analyze data using statistical methodologies; Partner with suppliers and research institutions to assess new process technologies; Support transition of pathfinding concepts into technology development.

Seniority

Senior, hands-on IC