Principal Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Core
Lead a team to develop and execute reliability test flows for High Bandwidth Memory (HBM) products, driving defect reduction and process improvements for DRAM and stacked die.
Role type
Principal Engineer, HBM Product Engineering (Reliability)
Builds
HBM products (DRAM and Interface die) for data centers, AI, and high-performance computing
Domain
Semiconductor manufacturing, High Bandwidth Memory (HBM), Reliability Engineering
Deliverable
production ML models
Required skills
Reliability test flow development, Root cause analysis (EFA/PFA), CMOS technology, DRAM architecture, Data analysis, Python, JMP, Machine learning (regression, classification, anomaly detection), Cross-functional collaboration, Project management, AI strategy implementation
Preferred skills
Semiconductor device physics, Process conversion experience, AI/automation adoption
Technologies
Python, JMP, Claude code, Agentic AI, EFA tools, PFA tools
Responsibilities
Define reliability stress test flows and plans; Drive extrinsic and intrinsic reliability (DPM reduction); Debug and resolve qualification and RMA failures via failure analysis; Recommend fab process conversions for yield and cost improvement; Manage risks associated with process conversions; Mentor engineers on AI adoption and reliability workflows; Apply machine learning to reliability datasets for fail segmentation; Collaborate with Fab, Design, and Quality teams.
Seniority
Principal, hands-on IC with team leadership
