PIE Engineer
Core
Establish, optimize, and continuously improve semiconductor process conditions and technology for next-generation memory products (DRAM, HBM) to drive yield improvement, defect reduction, and cycle-time optimization.
Role type
Process Integration Engineer (PI Engineer)
Builds
High-volume manufacturing of DRAM and HBM memory products
Domain
Semiconductor manufacturing / Memory and storage solutions
Deliverable
production ML models
Required skills
Semiconductor process integration, Yield improvement, Statistical process control, Data analysis, Process optimization, Reticle strategy, Layout optimization, AI-assisted analysis tools
Preferred skills
Machine learning, Digital transformation, Cross-site collaboration, Technology transfer
Technologies
AI-assisted analysis tools, Automation solutions, Data visualization platforms
Responsibilities
Define and maintain critical process windows, Lead reticle strategy planning and management, Develop creative engineering solutions for cost reduction, Use AI-assisted analysis tools to identify process weak points, Partner with global teams to align process strategies, Support new technology node development and product qualification
Seniority
Mid-Senior, hands-on IC