Principal/Staff Process Integration Engineer, NAND Technology Integration
Core
Lead process modules for 3D NAND semiconductor development, defining specifications, optimizing performance, and transferring technology from R&D to manufacturing.
Role type
Principal/Staff Process Integration Engineer (NAND Technology)
Builds
3D NAND semiconductor circuits and non-volatile memory devices
Domain
Semiconductor manufacturing / Memory technology
Required skills
Wafer fabrication process development, Process integration, NAND technology flow, Structural & electrical fail mechanisms, R&D to manufacturing transfer, Material analysis, Statistical data analysis, Team leadership, Cross-functional coordination, Scripting/programming
Preferred skills
Python, SolidWorks, Tableau, Power BI, AI tool literacy
Technologies
Dry Etch, Photolithography, Films, Wet Process, CMP, 3D NAND
Responsibilities
Define structural specifications and process requirements for assigned modules, Identify and resolve structure/electrical/reliability issues using model-based approaches, Optimize manufacturability assessments and parametric verification, Analyze materials physically and electrically for new material selection, Build and analyze device and process experiments, Coordinate development teams and set goals, Support technology transfer from R&D to high-volume manufacturing, Innovate to address complex problems and generate IP
Seniority
Principal/Staff, hands-on IC with strategic direction