Principal Engineer, NAND Advanced Thin Films Process Development
Core
Define and implement technical strategy for structural and electrical film process development for advanced NAND memory technology, ensuring successful integration into manufacturing.
Role type
Principal Engineer, Process Development (NAND Thin Films) (via careerplan.io/jobs/39505440-principal-engineer-nand-advanced-thin-films-process-development-at-micron)
Builds
Next-generation NAND memory devices and high-volume manufacturing processes
Domain
Semiconductor manufacturing, Memory technology, Thin film deposition
Required skills
Thin film deposition (ALD, CVD), Process-device interaction analysis, Reliability engineering, Failure analysis (XRR, SEM, TEM, SIMS, XPS), DOE/SPC, Cross-functional team leadership, Technology roadmap development
Preferred skills
Chamber design, Plasma source optimization, Gas delivery systems, Benchmarking and competitive analysis, Statistical process control
Technologies
Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), X-ray Reflectivity (XRR), Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), X-ray Photoelectron Spectroscopy (XPS), LowK/HighK films, Carbon-based films