MTS - HBM Thermal Integration Engineer
Core
Drive thermal performance optimization for next-generation High Bandwidth Memory (HBM) products through design, process, packaging, assembly, and test improvements.
Role type
Senior IC thermal integration engineer (semiconductor)
Builds
High Bandwidth Memory (HBM) solutions for AI and high-performance computing systems
Domain
Semiconductor / Memory / Advanced Packaging
Deliverable
production ML models
Required skills
Thermal simulation, multiphysics modeling, semiconductor product development, design of experiments (DOE), data analysis, root-cause investigation
Preferred skills
HBM, 2.5D/3D integration, TSV, hybrid bonding, Python, JMP, MATLAB, SQL
Technologies
Ansys, Abaqus, Icepak, FloTHERM, Star-CCM+
Responsibilities
Develop and implement thermal learning plans and characterization strategies; Analyze silicon characterization and manufacturing data to identify thermal drivers; Partner with simulation teams to correlate predictive models with measured performance; Resolve thermal challenges across fabrication, packaging, and assembly; Identify opportunities to reduce thermal resistance and enhance product performance.
Seniority
Senior, hands-on IC