ENGINEER, MTB PQA LAB
Core
Conduct failure analysis, root cause investigations, and advanced package characterization for semiconductor devices and packages to support product development and yield improvement.
Role type
Failure Analysis Engineer (Semiconductor)
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing and advanced packaging
Required skills
Failure analysis techniques (FI, VC, Delayer, Cross-section, Die-level), Root cause analysis, Electrical and physical analysis, Sample preparation, Technical reporting
Preferred skills
HBM failure analysis, Advanced packaging (TSV, Micro-bump, Hybrid bonding), Thermal failure analysis, Material characterization, Data analytics (Python, JMP, Power BI, SQL, Machine Learning)
Technologies
FIB, SEM/EDS, 3D X-ray/CT, CSAM, Optical Microscopy, EMMI, OBIRCH, PHEMOS
Responsibilities
Perform electrical and physical failure analysis of semiconductor devices and packages, Conduct root cause investigations and provide technical recommendations, Develop and execute analytical plans, Interpret analytical results and communicate findings, Collaborate with Process, Product, Quality, Reliability, and Manufacturing teams, Generate technical reports and present findings to stakeholders, Support urgent customer and production-related failure analysis activities
Seniority
Individual Contributor