CareerPlan

HBM De Bond Equipment Engineer

Taichung City, Taichung City, TaiwanFull-time2026-10-12 → 2026-11-10

Core

Establish and improve semiconductor equipment condition and technology, upgrade process capability, and reduce production costs for memory and storage manufacturing.

Role type

Semiconductor equipment engineer (HBM)

Builds

High-bandwidth memory (HBM) production lines and processes

Domain

Semiconductor manufacturing / Memory and storage

Required skills

Semiconductor equipment management, process parameter setup, abnormal analysis, cost reduction, equipment upgrade planning, data-driven insights, AI-enabled tools

Preferred skills

None stated

Technologies

None stated

Responsibilities

Establish and improve equipment condition and technology; Upgrade process capability and reduce production cost; Set up process parameters for semiconductor equipment; Evaluate and plan new equipment and materials; Perform abnormal analysis and improvement

Seniority

None stated