Intern- YE Physical Failure Analysis Engineer
Core
Support physical failure analysis investigations of defect issues in advanced memory devices by isolating, exposing, and imaging physical defects to find root causes.
Role type
Intern, Physical Failure Analysis (PFA) Engineer
Builds
Advanced memory devices (semiconductor)
Domain
Semiconductor manufacturing / Failure Analysis
Required skills
Semiconductor device knowledge, Sample preparation (deprocessing/delayering, cross-sectioning), FIB/SEM/TEM imaging, Data analysis, Root cause analysis, Technical reporting
Preferred skills
Cleanroom experience, Microscopy, JMP/Python/Excel, Previous internship in semiconductor
Technologies
FIB, SEM, TEM, JMP, Python, Excel
Responsibilities
Perform PFA sample preparation and analysis (deprocessing, cross-sectioning, FIB, SEM/TEM imaging), Review EFA results and probe/yield data to target physical analysis, Identify and categorize physical defect signatures, Summarize findings in clear reports and communicate to engineering partners, Operate PFA lab equipment safely, Complete a focused 3-month improvement project
Seniority
Intern