New College Grad - Process Integration Engineer
Core
Develop, optimize, and transfer advanced semiconductor manufacturing processes for next-generation memory technologies to improve yield, cost efficiency, and reliability.
Role type
Process Integration Engineer (New College Grad)
Builds
Next-generation memory devices (DRAM, etc.)
Domain
Semiconductor manufacturing / Memory technology
Required skills
Semiconductor process analysis, Root cause investigation, Failure analysis, Design of Experiments (DOE), Statistical Process Control (SPC), Data analysis (JMP), FMEA, 8D problem solving, SPC/FDC/RMS/APC systems
Preferred skills
Agentic AI workflows, AI tools for engineering, Automation solutions, Data analytics, 300mm wafer fabrication experience, Yield ramp management
Technologies
JMP, SPC, FDC, RMS, APC, MOSFET, CMOS, DRAM
Responsibilities
Own semiconductor process modules and lead root cause investigations; Drive improvements in yield, cost efficiency, and process performance; Design and analyze experiments (DOE) to improve process capability; Monitor process trends and sustain line stability; Support technology transfer activities and knowledge-sharing; Develop, optimize, and qualify new processes, equipment, and materials; Utilize methodologies (FMEA, 8D, SPC, FDC) to resolve process issues.
Seniority
Entry-level, New College Grad