Principal Engineer, HIG-HBM Design
Core
Design and analyze digital and analog circuits for HBM memory products, optimizing manufacturing functions and performance for ML/AI applications.
Role type
Principal Engineer, HIG-HBM Design
Builds
HBM memory products optimized for power, cost, quality, and reliability
Domain
Semiconductor / Memory / Machine Learning
Deliverable
production ML models
Required skills
High-speed memory design, Power domain network analysis, Memory test architectures (MBIST), Digital design methodologies (RTL, synthesis, physical implementation), ASIC design development, Memory core timing and signal integrity
Responsibilities
Craft and analyze digital and analog circuits for DRAM development; Collaborate with global design and verification teams; Innovate and integrate end-to-end front-end and backend processes; Develop lowest power per bit solutions for ML and AI fields.
Seniority
Principal, hands-on IC
