Senior Engineer, Advanced Packaging — Fail-Mode Metric Reaction (FMR)
Core
Drive yield analysis, failure mode characterization, and failure mechanisms understanding across test vehicles and advanced packaging products, owning the reaction loop between defect signatures and corrective actions.
Role type
Senior IC yield and failure analysis engineer (advanced packaging)
Builds
Data analysis pipelines, dashboards, and automated workflows for FMR response
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models
Required skills
Yield analysis, failure mode characterization, root cause analysis, physical failure analysis (FA), data analysis (Python, SQL, JMP), AI/ML for anomaly detection, process excursion triage, FA-to-fix loop management
Preferred skills
Reliability stress methodologies (HTOL, TC, uHAST), package fail mode testing
Technologies
Python, SQL, JMP
Responsibilities
Perform yield analysis for advanced packaging test vehicles and production products; Investigate and root-cause fail modes and fail mechanisms at time-zero; Drive reaction plans on internal reliability fails and customer RMAs; Build and maintain data analysis pipelines, dashboards, and automated workflows; Apply AI/ML techniques for signature classification and workflow automation
Seniority
Senior, hands-on IC