ENGINEER, HBM PROCESS
Core
Identify, diagnose, and resolve assembly process problems; execute process, equipment, and material evaluation/optimization; lead continuous yield improvement and cost reduction activities.
Role type
Manufacturing process engineer (semiconductor assembly)
Builds
High-performance DRAM, NAND, and NOR memory and storage products (via careerplan.io/jobs/44768662-engineer-hbm-process-at-micron)
Domain
Semiconductor manufacturing / Memory and storage
Required skills
Assembly process troubleshooting, Process optimization, Yield improvement, Cost reduction, SPC/FDC/RMS/APC support, Supplier quality management, Audit support, AI tool utilization for process improvement
Responsibilities
Identify, diagnose and resolve assembly process related problems; Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step; Lead / participate in continuous yield improvement and cost reduction activities; Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction; Support SPC/FDC/RMS/APC; Support site to site portability; Manage / audit material suppliers to achieve quality, cost and risk management objectives; Support internal and external audit, also using AI tool for process improvement.