Intern - Memory Design Engineer, HBM
Core
Design, development, and validation of High Bandwidth Memory (HBM) products for AI, high-performance computing, graphics, and data center applications.
Role type
Intern, Memory Design Engineer (HBM)
Builds
Next-generation HBM memory solutions
Domain
Semiconductor / Memory / AI Hardware
Required skills
RTL development, circuit implementation, simulation, verification, functional analysis, timing analysis, power analysis, scripting, automation, Python, Verilog, SystemVerilog, VHDL
Preferred skills
Memory architectures (DRAM, SRAM, DDR, LPDDR, HBM), RTL design, synthesis, design verification, Linux/Unix, semiconductor EDA tools (VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso), VLSI/ASIC/FPGA design, AI tools for engineering
Technologies
VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso, Python, Perl, Tcl, C/C++, Verilog, SystemVerilog, VHDL
Responsibilities
Assist with HBM memory and logic design activities including RTL development, circuit implementation, simulation, verification, and functional analysis; Develop and use scripting, automation, and AI-assisted workflows to improve design productivity; Perform timing, power, and functional analysis of HBM subsystems; Collaborate with Design Verification, Physical Design, CAD, and Product Engineering teams; Document technical work, experimental results, build methodologies, and AI-assisted insights (via careerplan.io/jobs/44702971-intern-memory-design-engineer-hbm-at-micron)
Seniority
Intern
