Intern - Design Engineer, HIG HBM
Core
Design, simulation, analysis, and verification of High Bandwidth Memory (HBM) memory and logic circuits for AI, high-performance computing, and data-center applications. (via careerplan.io/jobs/44547378-intern-design-engineer-hig-hbm-at-micron)
Role type
Intern, Design Engineer (Semiconductor/VLSI)
Builds
HBM memory architectures and semiconductor technologies for next-generation computing systems
Domain
Semiconductor industry, High Bandwidth Memory (HBM), VLSI/ASIC design
Required skills
Digital Logic Design, CMOS Circuits, Computer Architecture, Verilog/SystemVerilog/VHDL, Python/Perl/Tcl/C++
Preferred skills
Memory architectures (DRAM/SRAM/DDR/HBM), RTL design/synthesis/verification, Linux/Unix scripting, Semiconductor EDA tools (VCS/Xcelium/PrimeTime/Innovus)
Responsibilities
Assist with design, simulation, analysis, and verification of HBM circuits; Support RTL development, timing/power analysis, and functional validation; Develop automation scripts and AI-Assisted workflows; Collaborate with cross-functional teams on technical reviews and debug; Document technical work and design methodologies.