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HBM EQUIPMENT ENGINEER

Taichung City, Taichung City, Taiwan💼 Full-time🗓 2026-09-16 → 2026-10-07

Core

Leverage AI-enabled methods and data analytics to optimize semiconductor equipment utilization, yield performance, and manufacturing efficiency.

Role type

Senior IC equipment engineer (semiconductor manufacturing) (via careerplan.io/jobs/44501200-hbm-equipment-engineer-at-micron)

Builds

High-performance DRAM, NAND, and NOR memory and storage products

Domain

Semiconductor manufacturing / AI-driven operations

Deliverable

production ML models

Required skills

Semiconductor equipment engineering, AI-enabled troubleshooting, data-driven root cause analysis, process validation, supplier quality management, FDC/RMS/APC/SPC systems, Microsoft Copilot adoption

Preferred skills

TCB/DB process familiarity, predictive maintenance strategies, site-to-site best practice transfer

Technologies

Microsoft Copilot, Generative AI, advanced analytics tools, FDC, RMS, APC, SPC

Responsibilities

Identify and resolve assembly equipment issues using AI-supported methodologies; coordinate process and equipment evaluations; lead utilization and yield improvement initiatives; validate new processes for NPI; support FDC/RMS/APC/SPC systems; manage supplier quality and risk mitigation; support internal and external audits.

Seniority

Senior, hands-on IC