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Principal Engineer Advanced DRAM PI

Boise, Idaho, United States of America💼 Full-time🗓 2026-08-27 → 2026-09-25

Core

Lead the development of first-in-industry Advanced DRAM solutions by transforming innovative concepts into silicon and delivering breakthrough memory architectures.

Role type

Principal Engineer, Advanced DRAM Process Integration

Builds

Next-generation memory products and silicon implementations

Domain

Semiconductor / Memory Technology / Process Integration

Deliverable

production ML models | product features | physical/clinical work

Required skills

Process integration, device physics, materials science, experimental design, data analysis, cross-functional leadership, yield improvement

Preferred skills

Advanced-node memory development, circuit/architecture knowledge, reliability/failure analysis, AI-assisted analytics

Technologies

DRAM, NAND, TFTs, charge storage devices

Responsibilities

Lead process integration efforts for Advanced DRAM technologies; Develop and integrate new memory device architectures from concept through silicon; Design and implement experiments to evaluate device performance and reliability; Partner with cross-functional teams to optimize process flows; Drive yield improvement initiatives through data analysis

Seniority

Principal, hands-on IC with strategy

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