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Intern - ADV DRAM Process Integration Engineer

Boise, Idaho, United States of America💼 Internship🗓 2026-08-26 → 2026-09-26

Core

Intern role focusing on performance and manufacturability of next-generation 3D DRAM technology, specifically addressing integration and circuit issues.

Role type

Intern - ADV DRAM Process Integration Engineer

Builds

Next-generation 3D DRAM memory components and process flows

Domain

Semiconductor manufacturing / 3D DRAM technology

Required skills

Semiconductor device fabrication, electrical characterization, material characterization, process integration, data analysis, modeling, project management

Preferred skills

Data analysis and modeling proficiency, collaboration

Technologies

R&D fab equipment, inline parametric testing tools, probe testing systems

Responsibilities

Contribute to technology development for next-generation DRAM device components; Optimize process flows to meet product requirements; Engage cross-functional teams to solve performance and yield issues; Design and run experiments in the R&D fab; Analyze inline, parametric, and probe data to evaluate failure mechanisms and optimize device performance; Summarize complex problems and drive team implementation of solutions

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