Principal Analog Design Engineer, HBM
Core
Lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products, enabling industry-leading bandwidth, power efficiency, and reliability.
Role type
Principal Analog Design Engineer (HBM)
Builds
High-performance analog subsystems within HBM logic dies
Domain
Semiconductor / Memory / Analog IC Design
Required skills
High-speed interface design, Clocking circuits (PLL/DLL/CDR), Power management circuits, Analog IP integration, SPICE simulation, Silicon bring-up, Advanced CMOS processes, Noise/jitter/SI/PI analysis
Preferred skills
DRAM subsystem architecture knowledge, Physical Layout & Circuit Floor Planning
Technologies
SPICE, Advanced CMOS nodes
Responsibilities
Lead design of high-speed transmitters/receivers, clock generation/distribution, SerDes blocks, biasing/reference/calibration circuits, power delivery/regulation circuits, define IP interfaces and clocking schemes, perform pre/post-layout simulations and PVT/Monte Carlo analyses, collaborate with layout engineers on floorplanning and EM/IR compliance, review analog layouts, drive layout-aware design optimizations, define design best practices
Seniority
Principal, hands-on IC with technical leadership
