Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Core
Lead a high-performing team to develop and execute reliability test flows for Micron's latest High Bandwidth Memory (HBM) products, driving defect density reduction and root cause resolution for DRAM and Interface dies.
Role type
Senior IC Product Engineering Manager (Semiconductor Reliability)
Builds
HBM DRAM and Interface die products for data centers and AI applications
Domain
Semiconductor manufacturing and reliability engineering
Required skills
Reliability test flow development, Electric Failure Analysis (EFA), Physical Failure Analysis (PFA), Root cause analysis, Statistics and data analysis, Circuit analysis, Manufacturing test flow optimization, Cross-functional collaboration, Team leadership, Project management
Preferred skills
Logic or memory product experience, Product Engineering experience, AI tool integration, Process conversion expertise
Technologies
HBM, DRAM, Interface die, EFA, PFA, Manufacturing Test Flows
Responsibilities
Define and develop reliability stress test plans, Drive extrinsic and intrinsic reliability improvements, Debug and resolve qual/RMA failures via EFA/PFA, Lead process conversions for yield and cost improvement, Manage risks associated with DPM process conversions, Mentor team members, Collaborate with Fab, Design, and Quality teams
Seniority
Senior, hands-on IC with team leadership