Lead Staff Engineer / Lead Principal Engineer PD SG Diffusion/Implant
Core
Lead a team of Diffusion & Implant engineers to develop and optimize semiconductor manufacturing processes for 3D NAND nodes, driving process transfer to high-volume manufacturing and implementing AI/ML techniques for process optimization.
Role type
Lead Staff Engineer / Lead Principal Engineer (Semiconductor Process Development)
Builds
3D NAND process modules, cells, and high-volume manufacturing solutions
Domain
Semiconductor manufacturing / 3D NAND technology
Deliverable
production ML models
Required skills
Team leadership and mentorship, Process development and characterization, DOE-based experimentation, Data analytics and AI/ML application, Process integration and manufacturability, Supplier partnership and qualification, Cost reduction and productivity improvement, Advanced process monitoring and control
Preferred skills
Experience with 3D NAND nodes, AI-assisted tool integration, Cross-functional collaboration with Equipment Engineering and Manufacturing Development
Technologies
AI/ML tools, Data analytics platforms, Semiconductor process equipment
Responsibilities
Lead, hire, and mentor a team of Diffusion & Implant engineers; Own and drive DF and IMP process module development for 3D NAND nodes; Drive execution of process development activities aligned with TD roadmap; Collaborate with Process Integration, Manufacturing Development, and global TD teams; Lead transfer of processes to high-volume manufacturing; Drive DOE-based experiments to optimize process performance; Implement advanced process monitoring and control strategies; Identify and lead process simplification and cost reduction initiatives; Partner with equipment and materials suppliers for co-development; Drive adoption of AI/ML techniques to improve process understanding and optimization.