Principal Engineer – 3D NAND Process Integration
Core
Drive the future 3D NAND technology roadmap through advanced pathfinding, integration, and AI-enabled data analytics to solve critical scaling challenges.
Role type
Principal Engineer – 3D NAND Process Integration (R&D)
Builds
Next-generation memory technologies and manufacturable solutions
Domain
Semiconductor manufacturing / Memory (NAND/DRAM)
Deliverable
production ML models
Required skills
Semiconductor device physics, Process integration, Experiment design, Data analysis, Cross-functional collaboration, Technical innovation
Preferred skills
AI/ML techniques, Advanced data analytics
Technologies
AI-enabled data analytics, Model-driven methodologies
Responsibilities
Drive 3D NAND integration and technology roadmap; Lead end-to-end development from conception to technology validation; Solve complex integration challenges using data-driven and model-based approaches; Define and optimize module/process architecture; Collaborate across the full ecosystem (Device, Probe, Test, Design, Operations); Drive technical innovation through process improvements, patents, and publications
Seniority
Principal, hands-on IC with strategy & mentorship