Member of Technical Staff (MTS) – 3D NAND Process Integration
Core
Lead 3D NAND technology pathfinding and process integration, translating device concepts and process architecture into validated, manufacturable technology solutions.
Role type
Senior IC semiconductor process integration engineer (3D NAND)
Builds
Advanced 3D NAND memory technology and process architectures
Domain
Semiconductor manufacturing / Memory storage
Deliverable
production ML models
Required skills
Semiconductor device physics, Process integration, Process architecture, Experiment design, Data analysis, AI/ML techniques, Model-based methods, Technical problem-solving, Cross-functional collaboration
Preferred skills
3D NAND integration experience, Advanced architecture pathfinding, Technical innovation (patents/publications)