Electrical Failure Analysis Engineer – NAND Technology
Core
Diagnose yield-limiting failures in next-generation NAND products using bench testing, probe data analysis, and physical failure analysis to accelerate yield learning.
Role type
Senior IC electrical failure analysis engineer (NAND technology)
Builds
Next-generation NAND memory products
Domain
Semiconductor manufacturing / Nonvolatile memory technologies
Deliverable
production ML models | physical/clinical work
Required skills
Semiconductor failure analysis, root cause analysis, physical de-processing, data analytics for large-scale datasets, SEM/FIB/TEM/EDS/EELS expertise, knowledge of NAND/NOR process flow
Preferred skills
Experience in Process Integration or Yield Enhancement, technology transfer from R&D to manufacturing
Technologies
SEM, FIB, TEM, EDS, EELS
Responsibilities
Lead electrical failure analysis including characterization, fault isolation, and physical de-processing; Drive root cause analysis by correlating electrical, inline, parametric, probe, and fab data; Pioneer new FA methodologies and de-processing techniques; Apply data analytics to surface failure signatures and trends; Deliver FA reports and visualizations to technical and executive audiences; Partner with Process Integration, Yield Enhancement, Metrology, RDA, and Data Science teams; Support technology transfer of layout and architecture fundamentals; Present results in global forums
Seniority
Senior, hands-on IC
