Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)
Core
Lead global Product Integration efforts to improve yield, quality, and benchmark performance across technologies and products by integrating cross-site project data and resolving yield/quality issues.
Role type
Senior IC Product Integration Engineer (Semiconductor)
Builds
Scalable network-wide solutions for yield, quality, and NPI success across Test, Product, Yield, Front-End Manufacturing, and Packaging/BEOL.
Domain
Semiconductor manufacturing (Memory/Storage, DRAM, HBM)
Required skills
Semiconductor device physics, DRAM product operation, wafer fabrication, electrical/parametric testing, data analysis, debugging, technical problem solving, cross-functional collaboration, global project management
Preferred skills
DRAM High Bandwidth Memory (HBM) products, advanced packaging, chip-package interaction, BEOL integration, layout topics, developing Agentic AI workflows
Technologies
DRAM, HBM, HPM, BEOL, Packaging Technology
Responsibilities
Lead global Product Integration efforts to improve yield, quality, and benchmark performance; Integrate and drive execution of cross-site project data (design, test, yield, manufacturing); Define and execute strategies to ensure Packaging Technology and Chip-Package Interaction readiness; Lead cross-functional, global task forces to resolve yield and quality issues; Develop, standardize, and deploy best-known methods (BKMs) and business processes; Communicate status, risks, and technical proposals clearly and partner with leadership to drive results.
Seniority
Senior / Staff / Principal, hands-on IC with global leadership