Senior Integrated Photonics Packaging Engineer (RF) (m/f/d)
Core
Define, develop, and verify high-frequency RF and electro-optical packaging solutions for photonic computing modules, ensuring Signal Integrity (SI) and Power Integrity (PI) while managing global suppliers.
Role type
Senior IC integrated photonics packaging engineer (RF)
Builds
Miniaturized, high-performance photonic modules for AI and high-performance computing
Domain
Deep-tech / Semiconductor / Photonics / RF Engineering
Required skills
RF packaging, optoelectronic integration, high-density interconnect technologies, electromagnetic simulation, S-parameter measurements, EMC shielding, thermal management, advanced packaging substrates (HTCC, LTCC, HDI), Design for Manufacturability (DFM), statistical process control (SPC)
Preferred skills
German language, knowledge of industry standards (Telcordia, JEDEC)
Technologies
CAD tools for electronic packaging, electromagnetic modeling tools, co-simulation tools
Responsibilities
Define high-density electro-optical and RF packaging solutions, lead supplier-driven R&D packaging projects, perform electromagnetic modeling and EMC shielding implementation, drive DFM and PCB/package layouting, execute thermal management strategies, establish quality assurance protocols, implement new packaging materials or architectures annually
Seniority
Senior, hands-on IC
