Optical Module Hardware FAE Intern
Core
Support customer engagements and debug hardware/software systems for optical module products using PAM4 DSP, linear TIA, driver, and Coherent DSP technologies.
Role type
Field Application Engineering (FAE) Intern
Builds
Optical interconnect products (AEC, NPO, XPO, CPO) for data infrastructure
Domain
Semiconductor / Optical Communications / High-Speed SerDes
Deliverable
client delivery
Required skills
PAM4 DSP, Coherent DSP, linear TIA, driver chip design, optical communication systems, SI/PI simulation, hardware/software co-debugging
Preferred skills
AMS high-speed SerDes research, analog TIA design, 5nm/3nm/2nm process node knowledge
Technologies
PAM4, Coherent ODSP, 112G/224G/448G applications, SerDes DSPs
Responsibilities
Review customer schematic and layout designs, support lab activities for product tuning and optimization, participate in product bring-up and performance testing, assist in customer system debugging, create technical documentation and FAQs
Seniority
Intern