Structural/ Thermal Modeling Engineer 3
Core
Developing physics-based and data-driven multi-physics models (Thermo-Elastic, Structural, CFD) for semiconductor capital equipment components, bridging simulation with experimental data to drive design improvements.
Role type
Senior IC structural/thermal modeling engineer (semiconductor equipment)
Builds
Physics-based models, multi-scale simulations, and design optimization for semiconductor manufacturing tools
Domain
Semiconductor equipment / Mechanical engineering / Computational physics
Deliverable
production ML models
Required skills
Solid mechanics, heat transfer, fluid mechanics, AI/ML concepts, hybrid physics-based AI/ML modeling, statistical methods, uncertainty quantification, DOE, optimization, coding
Preferred skills
Experience with ABAQUS, ANSYS, NASTRAN, COMSOL, stochastic optimization tools, multi-scale modeling
Technologies
ABAQUS, ANSYS, NASTRAN, COMSOL
Responsibilities
Develop physics-based models for Thermo-Elastic, Structural and CFD applications; Develop methods for translating tool operational data into improved engineering designs; Develop and maintain live multi-physics models; Provide design improvements of in-service tools based upon quantitative field measured failure data; Work directly with mechanical, electrical, process and software engineers to define design requirements
Seniority
Senior, PhD level