Integration Engineer - BCD Technology
Core
Drive advanced BCD technologies from concept through qualification and readiness for volume manufacturing, ensuring robustness and manufacturability across device, process, and integration disciplines.
Role type
Senior IC semiconductor integration engineer (BCD technology)
Builds
High-voltage BCD platforms, embedded non-volatile memory modules, ROIC-optimized process flows, advanced capacitor options, low-power CMOS, and improved DMOS performance.
Domain
Semiconductor manufacturing (300mm), Back-end-of-line (BEOL), Power, Automotive, Industrial, Imaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
BEOL process integration, MIM capacitor integration, copper metallization, CMP, dielectric integration, post-fab process considerations, cross-module integration decision-making, yield learning, reliability analysis, process window definition, defectivity control
Preferred skills
300mm semiconductor manufacturing environment experience, packaging and post-fab readiness, standardized test vehicle development
Technologies
MIM capacitors, copper metallization, CMP, dielectric integration, BEOL stack, DMOS, CMOS, non-volatile memory
Responsibilities
Drive high-voltage BCD platform enhancements from development through qualification; Integrate embedded non-volatile memory modules into BCD technology; Enable ROIC-optimized process flows and advanced capacitor options; Develop low-power and low-noise CMOS options; Improve DMOS performance and reliability through device and process integration changes; Support packaging and post-fab readiness using standardized test vehicles
Seniority
Mid-level, hands-on IC