ENGR I, PROCESS; MFG (BACKEND)
Core
Develop, sustain, and improve QFN molding processes to ensure stable production, high yield, and product quality.
Role type
Process Engineer (Manufacturing)
Builds
QFN semiconductor packages
Domain
Semiconductor manufacturing
Required skills
root cause analysis, DOE, statistical analysis, process optimization, CAPA, technical coaching, compliance management
Preferred skills
NPI support, material evaluation, yield improvement, cost reduction
Technologies
QFN molding equipment, OCAP, control plans
Responsibilities
Monitor and improve molding KPIs including yield, scrap rate, machine utilization, and cycle time; Perform troubleshooting for molding defects like warpage, delamination, and voids; Develop and maintain process specifications and engineering documentation; Collaborate with cross-functional teams to resolve process and equipment issues; Analyze process data and implement corrective actions.
Seniority
Individual Contributor