SiC Wafer & Package Technology Development Engineer
Core
Lead qualification and development of SiC die sales and next-generation SiC technologies, ensuring they meet cost, performance, manufacturing, timeline, and reliability goals for customers.
Role type
Senior IC technology development engineer (SiC packaging)
Builds
Next generation SiC technologies and qualified SiC die packages
Domain
Semiconductor industry + SiC power device packaging
Required skills
Package design, wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding, wirebond, sintering, die attach, clip attach, reflow, molding, material interactions, project leadership, cross-functional team management
Preferred skills
MS in Material Science, Chemical Engineering, or Semiconductor Processes
Technologies
SiC, wirebond, sintering, die attach, clip attach, reflow, molding
Responsibilities
Qualify SiC die sales and development, lead technology development through cross-functional teams, document findings and process flows, lead maturity gate reviews, update customer assembly application notes
Seniority
Senior, hands-on IC