NPI Front End Engineer
Core
Introduce and maintain assembly processes to ensure manufacturing and quality requirements are met for new products, packages, and technologies.
Role type
NPI Front End Engineer (Semiconductor Packaging)
Builds
New product/package/technology transfer, production setup, validation, and ramp-up to mass production in semiconductor manufacturing.
Domain
Semiconductor industry, specifically packaging and manufacturing.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Assembly and test processes (wire bond, dicing, die attach), Solder ball/Cu pillar/hybrid/thermocompression bonding techniques, Power module packaging, Chip package (CPI), Design for Manufacturability, Risk assessment and mitigation, Bill of Material (BOM) selection, Process flow definition, Root cause analysis, DOE, SIPOC, Lean Six Sigma, Data analysis (JMP, Minitab, Power BI), AutoCAD, SPC, DFMEA, 8D.
Preferred skills
Semiconductor or silicon/silicon carbide wafer processing experience.
Technologies
Au, Cu, Al wire bonding, Solder ball, Cu pillar, hybrid, thermocompression, JMP, Minitab, Power BI, AutoCAD, 8D, SPC, DFMEA, DOE.
Responsibilities
Transfer, qualify, and ramp-up of new product/package/technology; Troubleshoot qualification failures and method issues; Define risk assessment and mitigation plans; Select materials, equipment, and manufacturing peripherals to meet quality and yield targets; Drive improvement projects for stability, yield, cost, and quality.
Seniority
Mid-Senior, hands-on IC
