Failure Analysis Engineer
Core
Conduct material and physical failure analysis of semiconductor components (SiC and Si) from wafer to packaged chips to support manufacturing, development, and customer claims.
Role type
Failure Analysis Engineer (Semiconductor Materials & Physics)
Builds
Production support for semiconductor manufacturing and product qualification
Domain
Semiconductor manufacturing (SiC, Si)
Deliverable
physical/clinical work
Required skills
Sample preparation (sectioning, grinding, polishing, decapsulation, layer removal), SEM, FIB, TEM, EDS/EDX, defect analysis, technical documentation
Preferred skills
SiC or Si technology experience, advanced analytical methods
Technologies
SEM, FIB, TEM, EDS/EDX
Responsibilities
Prepare and execute physical/material analyses of semiconductor samples; Prepare samples for analysis from wafer-level structures to packaged chips; Analyze semiconductor structures and defects; Evaluate material, structural, and process defects; Collaborate with Product Engineering, Process Engineering, and Quality teams; Prepare technical documentation and present findings to internal and external customers
Seniority
Mid-level IC
