NPI FE Technician
Core
Operate machines and Automated Test Equipment (ATE) for New Product Development (NPD) and Introduction (NPI), performing experiment and final test manufacturing functions while ensuring correct input/output quantities for EBR lots.
Role type
NPI FE Technician (Semiconductor Packaging & Manufacturing)
Builds
Test runs, records, charts, and graphs for engineering analysis to identify quality or yield issues.
Domain
Semiconductor packaging and manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wire bonding (Au, Cu, Al), dicing, die attach, solder ball, Cu pillar, hybrid, thermocompression bonding, power module packaging, chip package (CPI), semiconductor/silicon carbide wafer processing, data analysis (JMP, Minitab, Power BI), engineering tools (AutoCAD, 8D, SPC, DFMEA, DOE)
Preferred skills
None stated
Technologies
PAC system, ATE, AutoCAD, JMP, Minitab, Power BI
Responsibilities
Operate machines in assigned stages, collect necessary data, ensure correct input/output quantities for EBR lots, enter data into PAC system, perform tooling minor conversion and parameter adjustment, prepare ATE for testing, monitor and guide line operators, process test runs and prepare result records, provide technical assistance to process development, inspect and prepare test hardware, assist in selecting and setting up specialized test equipment, work with NPI engineers on verification and qualifications
Seniority
Mid-level, hands-on IC
