External Manufacturing NPI Engineer (Assembly Packaging)
Core
Drive new production introduction for next-generation silicon technology and packaging solutions, focusing on wafer-level packaging (WLP) and post-fab solutions from conceptualization to production launch.
Role type
Senior IC manufacturing NPI engineer (assembly packaging)
Builds
New product commercialization and production launch for backend external manufacturing
Domain
Semiconductor manufacturing (backend assembly and packaging)
Required skills
Wafer-level packaging (WLP), bumping, post-fab solutions, DFM, technology & manufacturability readiness, OSAT partnership, production ramp management, yield improvement, statistical analysis, DOE characterization, SPC, failure analysis
Preferred skills
Plating chemistry/process, material/metallurgy characterization, microstructural analysis, power device technologies (SiC, JFET, GaN, IGBT), IC package design/CAD/FEA simulation, Chip-to-Package Interaction (CPI) effect
Technologies
CAD, FEA simulation
Responsibilities
Own backend external manufacturing NPI from conceptualization to production launch; Drive DFM and technology readiness; Partner with OSATs for assembly readiness and qualification; Manage production ramp and resolve ramp issues; Establish Best Known Methods (BKM) and Best-in-Class practices; Participate in quality and process readiness audits; Drive continuous yield improvement.
Seniority
Senior, hands-on IC
