Wirebond & Die Attach Process Engineer (MES Project)
Core
Lead the digital design of Wire Bond and Die Attach manufacturing processes, including MES implementation and subsequent production optimization.
Role type
Process Engineer (MES Project)
Builds
Digital process controls, exception handling logic, and traceability workflows for semiconductor packaging
Domain
Semiconductor manufacturing (Wire Bond/Die Attach)
Required skills
Wire Bond process expertise, Die Attach process expertise, Statistical process control, Engineering change control, Process release strategies
Preferred skills
MES platform configuration (Siemens OpCenter), PAC integration awareness, Wedge bonding optimization, Die attach accuracy optimization
Technologies
Siemens OpCenter, MES platforms
Responsibilities
Define process flows, routing, material handling, and traceability within the MES; Design digital logic for process controls and exception handling; Align requirements between manufacturing and quality teams; Validate digital workflows and support UAT and deployment; Manage process stability and optimize process parameters using MES data
Seniority
Mid-level, hands-on IC