Process Development Engineer | RF Photonics
Core
Lead the development and implementation of heterogeneous integration of non-Si modulator materials into high-volume silicon photonics, bridging lab to fab for high-yield, reliable manufacturing.
Role type
Senior Silicon Photonics Process Engineer (Heterogeneous Integration)
Builds
High-volume silicon photonics chips with integrated non-Si modulator chiplets
Domain
Semiconductor manufacturing, Silicon Photonics, Heterogeneous Integration
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> physical/clinical work (manufacturing process modules)
Required skills
Die-to-wafer bonding, Wafer-to-wafer bonding, Planarization, Waveguide etching, Material physics (Lithium Niobate, Indium Phosphide), Statistical process control (SPC), Design of experiments (DOE), Root-cause failure analysis, Process characterization, Yield enhancement strategies
Preferred skills
Fusion bonding mechanisms, Cleanroom operation (dicer, grinder, bonder), High-speed photonic modulator device physics, JMP/Matlab/Python statistical analysis
Technologies
Lithium Niobate, Lithium Tantalate, Barium Titanate, Indium Phosphide, JMP, Matlab, Python
Responsibilities
Lead process development and optimization of volume die-to-wafer bonding and post-bond device processing; Own the non-Si material chiplet integration process module including dicing, grinding, bonding, and etching; Drive scaling from R&D prototyping to high volume manufacturing; Bridge fab operations and design teams to align processes with performance requirements; Work with tool vendors to reduce development time; Establish robust process controls and yield enhancement strategies; Develop process characterization and troubleshooting procedures; Research differentiating process techniques beyond state of the art.
Seniority
Senior, hands-on IC
